K&S is the leader in wire and ribbon bonding for power semiconductors, automotive power modules, and industrial power hybrids. K&S wedge bonders ultrasonically bond round aluminum wires from 25 to 500 microns in diameter (1-20 mils) and use the PowerRibbon® process to ultrasonically bond aluminum ribbons from 500 x 100 to 2000 x 300 microns in cross-section (20 x 4 - 80 x 12 mils).
 
For over 45 years, K&S wedge bonder products have been recognized for exceptional performance, reliability, and excellent after-sales support.  Its bonders are created to cater to industries' needs of smaller, thinner, and denser semiconductor packages.